DB HiTek’s commitment to continuous quality enhancement is driven by manufacturing personnel who are trained and certified to meet the highest quality standards. Through the deployment of quality improvement teams, we regularly perform internal quality audits and management reviews of critical systems and procedures.

Our Failure Mode Effects Analysis (FMEA) system isolates potential failure modes so that we can prevent them from occurring before implementing new products/processes limiting changes to existing ones.

DB HiTek’s manufacturing processes are monitored, analyzed and strictly controlled using proven Statistical Process Control (SPC) techniques. Supported by the Yield Enhancement Data Analysis System (YEDAS), our SPC methodology ensures that processes and equipment perform optimally throughout the entire wafer fabrication process.

While our process change control system enables modifications to be made without compromising quality, our use of Inline Monitoring Tool provide real-time feedback on both component-level and package-level reliablity. Thanks to the process control disciplines at DB HiTek, corrective and/or preventative actions are routinely performed to deliver the highest levels of quality and reliability.

DB HiTek quality assurance begins with a regimented quality control plan that sets forth all critical steps needed to assure that quality goals are met or exceeded. This porven structured approach first drives the formulation of quality control methods to be used and then tracks their implementation. DB HiTek’s quality assurance initiatives encompass regular calibration of instruments and strict quality data control as well as an incoming/outgoing quality control disciplines. The quality control of nonconforming products is managed by DB HiTek’s Material Review Board(MRB), which evaluates risks and renders final dispositions based on comprehensive data input.

DB HiTek strives to build reliability disciplines into all of its manufacturing operations. This commitment begins with process qualification to assure that certain reliability characteristics are demonstrated and specific electrical tests are passed. Once a given process is qualified, our Wafer Level Reliability Monitoring(WLRM) program detects sensitivities to potenial failure mechanisms so that they can be eliminated.

Our reliability engineers also perform constructional analysis to detect any circuit fauit faults and design weaknesses with the goal of optimizing the chip manufacturing process. Failure analysis, another critical step to assure reliability, focuses on isolating the cause of failre on the die and physically characterizing it. DB HiTek’s disciplines to assure reliability are also evident when there is a need to modify a process.